Silicon Ingot
Solid, initially machined material for subsequent sizing, cutting and precision machining.
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Silicon Cylinder
Cored and formed cylindrical material provides blanks for silicon ring etch components.
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Silicon Ring
Materials and blanks for silicon rings in etch equipment, with dimensions and machining defined by drawings.
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Silicon Rod
Confirm material and machining plans against drawings and technical requirements.
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Silicon Fin
Confirm material and machining plans against drawings and technical requirements.
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Showerhead
Confirm material and machining plans against drawings and technical requirements.
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Silicon Electrode
Confirm material and machining plans against drawings and technical requirements.
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Silicon Boat
Confirm material and machining plans against drawings and technical requirements.
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Silicon Liner
Confirm material and machining plans against drawings and technical requirements.
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Silicon Materials
Silicon ingots, cylinders, rings and rods
Silicon Components
Geometry and machining defined by application requirements
New product images are illustrations. Actual geometry and specifications are subject to approved drawings.
Material Specifications
Silicon Ingot
Silicon Cylinder
Silicon Ring
Material type
Monocrystalline silicon
Monocrystalline silicon
Monocrystalline silicon
Principal sizes
450–600 mm (specific sizes subject to technical agreement)
450–600 mm (specific sizes subject to technical agreement)
450–600 mm (specific sizes subject to technical agreement)
Purity
>8N
>8N
>8N
Conductivity type
P-type (boron) / N-type (phosphorus)
P-type (boron) / N-type (phosphorus)
P-type (boron) / N-type (phosphorus)
Resistivity
<0.02、1–4、60–90 Ω·cm
<0.02、1–4、60–90 Ω·cm
<0.02、1–4、60–90 Ω·cm
Dimensional tolerance
Within ±0.05 mm
Within ±0.05 mm
Within ±0.05 mm
Flatness
≤15 μm; high grade ≤8 μm
≤15 μm; high grade ≤8 μm
≤15 μm; high grade ≤8 μm
Surface roughness
Standard Ra≤0.4 μm; polished Ra≤0.1 μm
Standard Ra≤0.4 μm; polished Ra≤0.1 μm
Standard Ra≤0.4 μm; polished Ra≤0.1 μm
Product specifications, inspection methods and delivery condition are governed by mutually approved technical agreements and drawings.